Recap of Our Successful Participation at CHINAPLAS 2025 Shenzhen

Introduction

Last week, Jiangsu GroupSmart New Material Co., Ltd proudly participated in CHINAPLAS 2025 Shenzhen, Asia's premier plastics and rubber trade fair. As a leading innovator in multi-layer coextruded high-barrier films (EVOH), we seized this opportunity to connect with industry leaders, showcase our latest advancements, and explore emerging trends shaping the future of packaging. Here are the highlights from our impactful presence at the show.

Our Exhibition Highlights

A. Next-Gen High-Barrier Film Solutions on Display

We unveiled our newest EVOH-based coextruded films, featuring:

Ultra-thin, high-performance barrier layers for food and pharmaceutical packaging

Sustainable mono-material structures (PE/EVOH/PE) designed for recyclability

Anti-fog and antimicrobial variants for fresh food applications

Visitors were particularly impressed by our 11-layer coextrusion technology, which delivers superior oxygen and moisture resistance while reducing material usage.

B. Live Demonstrations & Technical Talks

Our booth hosted:

- Interactive sessions on optimizing barrier film performance

- Case study presentations featuring successful implementations with global brands

- Live extrusion process simulations to demonstrate production efficiency

Key Industry Trends Observed

A. Sustainability Dominates Conversations

- Growing demand for recyclable high-barrier solutions to replace aluminum laminates

- Increased interest in bio-based EVOH materials and chemical recycling compatibility

B. Smart Packaging Integration

- Strong focus on active/intelligent packaging combining EVOH with:

- Oxygen scavengers

- Time-temperature indicators

- RFID tracking layers

C. Regional Market Growth

- Southeast Asian manufacturers showing particular interest in cost-optimized barrier solutions

- European brands seeking EU-compliant recyclable structures

Valuable Connections Made

We're thrilled to have engaged with:

200+ qualified leads from food, pharma, and electronics packaging sectors

30+ potential partners for joint development projects

15 industry analysts discussing future market directions

Special thanks to our partners at Jiangsu Fengyuan New Material Technology Co., Ltd. for collaborative booth presentations.

What's Next After CHINAPLAS?

The insights gained will directly influence our 2025-2026 R&D roadmap, with focus on:

- Thinner barrier films without performance compromise

- Enhanced recycling technologies for multi-layer structures

- Expanded production capacity to meet growing Asian demand

Conclusion & Invitation

CHINAPLAS 2025 reinforced our position as an innovation leader in high-barrier films. We appreciate everyone who visited our booth and shared valuable perspectives.

Missed us at the show?

➡ Contact our team to discuss your barrier packaging needs

➡ Download our show-exclusive technical package [Link]

➡ Save the date for CHINAPLAS 2026 Shanghai

Tags: #CHINAPLAS2025 #High Barrier Films #EVOH #Sustainable Packaging #Plastics Industry